The influence of surfactant (technical product «Dispersant Telaz D») on the wetting of metal substrates with a silicon solution. It is shown that the surfactant improves the wetting of the metallic substrate wetting ability, and silicone fluids are closely correlated with their dispersant activity.
Silicone lacquer paint materials historically occupy a significant market share of coatings. Their quality of coatings depends largely on the degree of dispersion of their component pigments. Effective process for dispersing pigments, a great importance is the ability of the pigmented particles wetted components of the liquid dispersion medium. The purpose was to study the effect of surfactants (hereinafter SAS) wetting metallopigment. As the surfactant used technical condensation product of vegetable oils with diamines under the trademark «Dispersant Telaz D» (molecular weight – 2121 amu; amine number (HCI mg/g) – 32), the manufacturer of «Avtokoninvest», Russia.
It has been established that the layer was formed on an aluminum substrate with toluene at the boundary with the water is hydrophobic, the contact angle is equal to 116,3°. In contrast, the interfacial layer, which was formed in the presence of surfactants, had a completely different surface properties (possessed significantly lower hydrophobicity). Since the introduction of surfactant in toluene, water contact angles of metals decreased by 12–15°. With the introduction of surfactant in dilute solutions of resin content (10 % silicones), water contact angles decreased by 8–12°. Change in the interaction with the surface of the pigment wetting liquid, as a result of adsorption of surfactants, can be determined by changing the values of «relative work of wetting». In assessing this parameter is set, that the introduction of surfactant is increased wetting of metal substrates solutions silicones. Established patterns of change in the wetting activity are closely correlated with changes in patterns of dispersion metallopigment.
The work is submitted to the International Scientific Conference «Modern high technologies», Israel (Tel Aviv), April 25 – May 2, 2014. came to the editorial office оn 04.02.2014.